BGA Rework Flip Chip Die Bonder Suppliers
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Mission, Quality policy statement and Company Values. New Packaging Developments and Production. Since more than 50 years we supply equipments, materials and services from leading world manufacturers. ELECTRON MEC partners are high tech international market leaders. We can provide our customers with the ultimate innovations from all over the world.
堆叠封装 PoP 是指纵向排列的逻辑和存储元件的集成电路封装形式, 它采用. How to - application video. How to - application video. Finetech Presents Production Equipment at Productronica 2017.
Automatischer Sub Micron Bonder für Produktentwicklung und Produktion. 0,5 µm, 300 mm Wafer,. Bewährte Heißgas-Technologie für reproduzierbare Prozesse. Bewährte Heißgas-Technologie für reproduzierbare Prozesse. Boards bis 460 x 310 mm.
Up to 3 µm accuracy. Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. The perfect blend of performance and cost for Rework.
IPC J-STD-001 Training en Certificering. IPC Training en Certificeringscentrum - PIEK.
IPC J-STD-001 Schulung und Zertifizierung. IPC Schulungs- und Zertifizierungszentrum - PIEK. Über PIEK und IPC Schulung. PIEK gehört zu den wenigen IPC Schulungszentren in Europa, das b.
Cégünk megoldást kínál e problémára. Amennyiben felkeltettük érdeklődését, tekintse meg ESD. Vagy vegye fel a kapcsolatot Kollégáinkkal, az ITT. Tudta Ön, hogy mi a JIG? Elsődleges célja tehát a folyamat ismételhetősége, pontossága és a termék felcserélhetősége. Ekre, hiszen a szerszám irányítása digitálisan programozott - a memóriában tárolható - így az irá.
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BGA Rework Flip Chip Die Bonder SuppliersDESCRIPTION
SupplierManufacturer of Flip Chip bonders, Die bonders, BGA QFN SMT rework stations, soldering equipment, smt rework and pick and place machinesCONTENT
This domain has the following on the web page, "Up to 3 µm accuracy." Our analyzers observed that the web site also said " Production Platform, Maximum Yield." The Website also stated " 05 micron, 300 mm wafer. Bonding forces up to 1000N. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical." The website's header had Die Bonder as the most important keyword. It was followed by Flip Chip Bonder, Bonding, and soldering which isn't as highly ranked as Die Bonder. The next words the site uses is Rework station. BGA rework was also included and will not be seen by search engines.MORE BUSINESSES
Spectra building, 12th km Thessalonikis- N. Argenta Spółka z ograniczoną odpowiedzialnością Sp. Ul Polska 114, 60-401 Poznań. Bucuresti, 030494, Bulevardul. 0040 21 340 17 27.
Andrea Ronqui Design, web, arte.
Purchase a 2271A Pressure Calibrator and get a free Pressure Module. Four times more calibration throughput and twice the accuracy of Micro-Baths and dry-blocks.
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