BGA Rework Flip Chip Die Bonder Suppliers
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Alltrotec GmbH feiert 25-jähriges Firmenjubiläum. Die alltrotec GmbH feiert in diesem Jahr ihr 25-jähriges Firmenjubiläum. Mit Kunden, Partnern und Wegbegleitern blickt die alltrotec auf ihrem Kundentag am 3. Juni 2015 in Dresden auf die kontinuierliche Entwicklung der. Alltrotec-Terminübersicht für 2015 ist online. Neue Studie zu Kosten bei ERP-Implementierung.
Up to 3 µm accuracy. Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. Proven technology where process reproducibility is critical.
堆叠封装 PoP 是指纵向排列的逻辑和存储元件的集成电路封装形式, 它采用. How to - application video. How to - application video. Finetech Presents Production Equipment at Productronica 2017.
Up to 3 µm accuracy. Production Platform, Maximum Yield. 05 micron, 300 mm wafer. Bonding forces up to 1000N. Volumetric dispensing with high quality results. Platforms, Finetech develops highly customized equipment solutions according to specific application requirements. The perfect blend of performance and cost for Rework.
Kameragestütztes Rework von BGA, CSP, QFN. Familie von Heißluft-Reworksystemen mit hohem Automatisierungsgrad. Manuelles Rework von BGA, QFP, und Steckern. Familie von SMD Heißluft-Reworksystemen mit Startool-Technologie. Der SMART DESOLDER kombiniert eine manuelle Heißgasquelle mit einem Vakuumgriffel. Familie der bewährten Unterheizungen mit IR Technologie.
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SupplierManufacturer of Flip Chip bonders, Die bonders, BGA QFN SMT rework stations, soldering equipment, smt rework and pick and place machinesCONTENT
This domain has the following on the web page, "Automatischer Sub Micron Bonder für Produktentwicklung und Produktion." Our analyzers observed that the web site also said " 0,5 µm, 300 mm Wafer,." The Website also stated " Bewährte Heißgas-Technologie für reproduzierbare Prozesse. Bewährte Heißgas-Technologie für reproduzierbare Prozesse. Boards bis 460 x 310 mm." The website's header had Die Bonder as the most important keyword. It was followed by Flip Chip Bonder, Bonding, and soldering which isn't as highly ranked as Die Bonder. The next words the site uses is Rework station. BGA rework was also included and will not be seen by search engines.MORE BUSINESSES
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To recover your password please fill in your email address. By Our Highly Efficiency Team. More than 10 Years of experience in custom synthesis makes us professional in chemical and pharmaceutical Industry.
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We at FineTech Controls provide the complete Industrial Automation Solutions. Is an ISO 9001- 2008 Company. is in the field of Industrial Automation, Process Control Engineering and System Integration.